Product Details:
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Type: | Jammer Module | Chipset: | GaN High Power Chip |
---|---|---|---|
Supplier Type: | Manufacturer | Application: | Drone FPV Jammer System |
Product Name: | FPV Jammer Module | Frequency: | 900MHz-1000MHz |
Power: | 47dbm | Interface: | SMA-F |
Current: | 3.2A @28V, 47dBm | Power Socket: | 15cm Red/black Wire |
Net Size: | 131*53*17mm | Net Weight: | 0.22Kg |
Voltage: | 28V | Working Frequency: | 200M -6100MHz(customized) |
Output Power: | 10W 20W 30W 40W 50W 60W 100W(customized) | ||
Highlight: | 1000M GAN Drone Jammer Module,Signal Blocker Module 900M,ACASOM Drone Jammer Module |
The 50W drone FPV jammer independently developed by ACASOM is mainly used to shield drone and FPV, and the shielding distance is 1-2km. This product use the latest generation of power devices-gallium nitride(GAN), which uses a ceramic package and a copper gold-plated substrate process. This product also uses circulators and isolators, which greatly provides product stability. In addition, the shell of our product uses the nickel plating process of aviation aluminum box, which greatly provides the service life of the product. This series of products have 200M, 300, 400M, 500M, 600M, 700M, 800M, 900M, 1000M, 1.2G, 1.3G, 1.4G, 1.5G,1.7G, 2.2G, 2.4G, 3.5G, 4.8G, 5.0G, 5.2G, 5.7G, 5.8G, 6.1G and other frequency bands. The output power of this series of products is 10W, 20W, 30W, 40W, 50W, 60W, 100W and other power levels.
No. | Items | Specifications |
1 | Frequency range | 900MHz-1000MHz |
2 | Operating Voltage | 28V |
3 | RF PORT | SMA-F |
4 | Output Power | 47dBm |
5 | Current | 3.2A @28V, 47dBm |
6 | Efficiency | 55%@47dBm |
7 | LED State | Red |
8 | Operating Temperature | -30℃~85℃ |
9 | Storage Temperature | -40℃~150℃ |
10 | Operating Humidity | <95%RH |
11 | Flatness | ±0.5dB |
12 | Power Socket | 15cm red/black wire |
14 | Shell Size | 131*53*17mm |
15 | Net Weight | 0.22Kg |
1. The GAN chip (not plastic packaging, black chip) is packaged with military ceramics, and the chip substrate uses copper gold plating process to improve heat dissipation and product life
2. The PCB uses thick gold plating ( thickness above 0.3um) process to improve the high-power and high-frequency RF performance
3. The shell adopts aviation aluminum and military nickel plating technology to provide the conduction effect and stability of the product
4. Using an ultra-low loss circulator, the GAN chip will not burn out when the antenna is not installed
5. Each product will undergo strict high and low temperature tests and aging tests to improve the installation efficiency of system products
4.GAN Chip Advantages
1. High output power and High working efficiency, above 50%;
2. GAN's chips are packaged in ceramic, not plastic,enhance service life;
3.GAN's chips have a pure copper gold-plated substrate to enhance heat dissipation and service life;
4. When you're not installing the antenna, Jammer won't burn out.
Contact Person: Mr. tommy
Tel: 18625215257